Rapid setting adhesive and method of its use

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156310, 156335, 428 58, 428525, 428529, 525501, 525504, B29C 6500

Patent

active

056267053

ABSTRACT:
A rapid curing adhesive for wood finger jointing and laminating and a method of its use are disclosed. The adhesive consists of two parts that are used as a honeymoon system. One part is used on one side of the joint being formed and the other part on the other side. When the parts are joined under pressure a very rapid reaction occurs resulting in a durable weather resistant joint. Wood finger joints bonded with the adhesive can be handled for further processing within as little time as 15 seconds. The first part of the adhesive is a conventional resorcinol-formaldehyde or phenol-resorcinol formaldehyde resin containing a hardener such as an alkylene group donor. The second part is a similar resin lacking any hardener but containing a modifier which is a heterocyclic oxygen and nitrogen containing compound. Morpholine has proved to serve well as the modifier. The hardener in the first part is used in a sufficient amount to effect a thermosetting cure for the resin used in both parts. Despite the rapid reaction when the two parts are combined, the adhesive has a significant closed assembly time tolerance before application of full pressure to the joint.

REFERENCES:
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patent: 2385372 (1945-09-01), Rhodes
patent: 2414414 (1947-01-01), Rhodes
patent: 2495175 (1950-01-01), Nagel
patent: 2557826 (1951-06-01), Keaton et al.
patent: 3492263 (1970-01-01), Kreibich et al.
patent: 3784514 (1974-01-01), Tiedeman
patent: 3784515 (1974-01-01), Freeman et al.
patent: 3786025 (1974-01-01), Freeman et al.
patent: 3802986 (1974-04-01), Forsythe
patent: 4061620 (1977-12-01), Gillern
patent: 4146513 (1979-03-01), Weaver et al.
Chemical Abstracts 91:88 (1979), Abstract No. 159311c.

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