Removal of extended bond pads using intermetallics

Details Removal of extended bond pads using intermetallics Removal of extended bond pads using intermetallics

1996-09-20

1999-03-23

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257737, 257786, 257781, 257673, H01L 2348, H01L 2954, H01L 23485

Patent

active

058864148

ABSTRACT:
Removable extension areas electrically connected to the original die bond pad allow for testing connections to be made. After removal of the extension areas, the circuitry below the region of the extension areas can be seen through a microscope. The use of perforations and/or underlayer sections can aid in the removal of the extension areas. Underlayer sections may comprise a metal that forms an intermetallic interaction with the metal layer of the extension areas.

REFERENCES:
patent: 3973271 (1976-08-01), Okumura et al.
patent: 4622574 (1986-11-01), Garcia
patent: 4693770 (1987-09-01), Hatada
patent: 4951098 (1990-08-01), Albergo et al.
patent: 4959706 (1990-09-01), Cusack et al.
patent: 4984065 (1991-01-01), Sako
patent: 5053850 (1991-10-01), Baker et al.
patent: 5156997 (1992-10-01), Kumar et al.
patent: 5367763 (1994-11-01), Lam
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5394013 (1995-02-01), Oku et al.
patent: 5404045 (1995-04-01), Mizushima
patent: 5483741 (1996-01-01), Akram et al.
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5508229 (1996-04-01), Baker
patent: 5517127 (1996-05-01), Bergeron et al.
patent: 5541446 (1996-07-01), Kierse
patent: 5631499 (1997-05-01), Hosomi et al.
patent: 5640762 (1997-06-01), Farnworth et al.
patent: 5742100 (1998-04-01), Schroeder et al.

Affiliated with

Also associated with

Rating

Removal of extended bond pads using intermetallics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Removal of extended bond pads using intermetallics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Removal of extended bond pads using intermetallics will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2129093