Method and compositions for removal of moisture

Details Method and compositions for removal of moisture Method and compositions for removal of moisture

1985-12-26

1987-01-20

Miller, Edward A.

Package making

Methods

With contents treating

53431, 53474, 252194, 523455, 525507, 528112, 528115, 528565, B65B 5500

Patent

active

046371974

ABSTRACT:
Methods and compositions are disclosed for absorbing moisture when moisture constraints are present. The moisture absorbing compositions include a curable epoxy resin, a curing agent, and an anhydride of a carboxylic acid. In one embodiment, the anhydride component is present in an amount sufficient both to cure the resin and to absorb the moisture. In other embodiments, a separate curing agent is included. Methods employing such compositions as adhesives or coatings, particularly in electronic device packaging, also are disclosed.

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