Metal fusion bonding – Solder form
Patent
1995-11-20
1997-05-06
Elpel, J.
Metal fusion bonding
Solder form
228255, 228246, 29843, 439 83, B23K 3514
Patent
active
056262787
ABSTRACT:
A solder delivery and array device for soldering electronic components and/or IC chips to printed circuit boards (PCB) or substrates comprises solder performs with predetermined weight, size, shape, and a flexible retaining means with spaced openings according to the layout of pins or leads of the components and/or IC chips. The solder performs are positioned and fixed in the openings through mechanical locking. The devices are located between components and PCB or substrate during the soldering processing. By using these devices, through hole type components and surface mount type parts can be attached onto the PCB through heat reflow soldering at same time without the wave soldering process, and overheating can be avoided during the soldering process especially for the pin grid array component. Another bonus for the application of the device is shorting the required lead time for research and development in new electronic products.
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