Microwave transistor package

Details Microwave transistor package Microwave transistor package

1974-10-04

1976-02-03

James, Andrew J.

Wave transmission lines and networks

Automatically controlled systems

With control of equalizer and/or delay network

357 72, 357 81, 333 84M, 174 52S, H01L 2302, H01L 2312

Patent

active

039368645

ABSTRACT:
A microwave transistor package which will accommodate large transistor chips as well as provide sufficient space for the addition of tuning capacitors or other circuits. The lead length inside of the package is minimized. A ceramic mounting pad is brazed to an underlying copper base and a nickel aperture plate is mounted around the mounting pad. The amount of ceramic material used is much less than in prior art devices. Tuning capacitors or other devices are mounted upon the top surface nickel spacer and connected to the transistor chip. In the preferred embodiment, the entire package is hermetically sealed.

REFERENCES:
patent: 3500066 (1970-03-01), Pritchett
patent: 3626259 (1971-12-01), Garboushian
patent: 3651434 (1972-03-01), McGeough
patent: 3681513 (1972-08-01), Hargis
patent: 3801938 (1974-04-01), Goshgarian
patent: 3825805 (1974-07-01), Belohoubeck

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