Stacking of three dimensional high density interconnect modules

Details Stacking of three dimensional high density interconnect modules Stacking of three dimensional high density interconnect modules

1997-01-28

1997-12-16

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 361761, 361764, 361803, H01R 2370, H01L 23055

Patent

active

056992343

ABSTRACT:
A method for fabricating a stack of circuit modules includes providing a plurality of substrates having module interconnection layers. Each of the substrates has a circuit chip with chip pads positioned therein and an electrically conductive feed-through line extending from a first surface of the substrate to a second surface of the substrate with the first surface being perpendicular to the second surface. Each of the module interconnection layers is situated over a respective first surface of each of the substrates and includes a module dielectric layer having module vias therein and a module pattern of electrical conductors extending through the module vias to couple the selected chip pads to the feed-through line. The plurality of substrates are stacked. A side interconnection layer is applied over a side surface including the second surfaces of the substrates. The side interconnection layer includes a side dielectric layer having side vias therein aligned with predetermined ones of the feed-through lines and a side pattern of electrical conductors extending through the side vias.

REFERENCES:
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5281852 (1994-01-01), Normington
patent: 5324687 (1994-06-01), Wojnarowski
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5466634 (1995-11-01), Beilstein, Jr. et al.
patent: 5517754 (1996-05-01), Beilstein, Jr. et al.
patent: 5563086 (1996-10-01), Bertin et al.
patent: 5567654 (1996-10-01), Beilstein, Jr. et al.
patent: 5571754 (1996-11-01), Bertin et al.

Affiliated with

Also associated with

Rating

Stacking of three dimensional high density interconnect modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacking of three dimensional high density interconnect modules , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacking of three dimensional high density interconnect modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-212618