Method of packaging high voltage components with low voltage com

Details Method of packaging high voltage components with low voltage com Method of packaging high voltage components with low voltage com

1995-11-24

1997-12-16

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174261, H05K 500

Patent

active

056992319

ABSTRACT:
An electronic circuit package in which several high voltage components are packaged along with low voltage components using standard circuit boards and minimizing the space needed for the entire assembly. A miniature circuit board, constructed of standard circuit board material, is used to mount several electronic components, some of which require high voltages. To meet isolation requirements, requiring a dielectric strength more than that provided by the board itself, between the high and low voltage nodes the circuit board incorporates slots or other cut out shapes in the board. The slots or other cut out shapes provide two functions. The first use for the slots or other cut out shapes is to prevent charge migration on the surface of the board between high and low voltage nodes. This is accomplished by placing the slots or other cut out shapes between high and low voltage nodes. The circuit board is then encapsulated within a potting material. The slots or other cut out shapes perform a second function of allowing the potting material to flow around and through the board to facilitate full encapsulation of the board and the electronic devices on the board. Several of the slots or other cut out shapes are placed in the board directly underneath the electronic devices mounted on the board to aid in allowing the potting material to completely surround and encapsulate the electronic devices.

REFERENCES:
patent: 3753046 (1973-08-01), Towell
patent: 5394301 (1995-02-01), Fassel et al.

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