Compliant hinge clip attachment

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

248510, 257719, 361704, H05K 720

Patent

active

056992297

ABSTRACT:
An electronic assembly that contains a pair of C-shaped springs that couple an integrated circuit and a lid to a printed circuit board. The assembly includes a first spring that is mounted to the printed circuit board. The first spring has a C-shaped finger. The integrated circuit is typically mounted to a substrate that is plugged into a socket which is mounted to the printed circuit board. A lid is stacked on top of the integrated circuit. The lid has a ball shaped outer rim. The assembly has a second spring which has a C-shaped finger that captures the outer rim of the lid, and a ball that is captured by the C-shaped finger of the first spring. The first and second springs are interlocked to secure the lid and integrated circuit to the printed circuit board. The lid and integrated circuit can be detached from the assembly by merely deflecting the second spring 36 and removing the components. The springs allow the lid and printed circuit board to thermally expand without creating excessive stresses in the assembly.

REFERENCES:
patent: 4679118 (1987-07-01), Johnson
patent: 5099550 (1992-03-01), Beane
patent: 5304735 (1994-04-01), Earl
patent: 5541811 (1996-07-01), Henningsson
patent: 5548482 (1996-08-01), Hatauchi

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Compliant hinge clip attachment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compliant hinge clip attachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compliant hinge clip attachment will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-212577

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.