Process for manufacturing a semiconductor device having a non-po

Metal working – Method of mechanical manufacture – Assembling or joining

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357 52, H01L 2156

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active

044060530

ABSTRACT:
A process for manufacturing a semiconductor device comprises the step of annealing a porous passivation layer which is deposited on the surface of the device and which covers metallization layers fabricated thereon, by irradiating a laser beam on the passivation layer so as to densify the passivation layer, while the laser beam scans the surface of the passivation layer.

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Auston, D. H. et al., "Lasers for Material Processing Applications", in Bell Laboratories Record, Jul./Aug. 1979, pp. 188-189.
Auston, D. H. et al., "New Role for the Laser", in Bell Laboratories Record, Jul./Aug. 1979, pp. 187-191.

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