Packaging of a semiconductor

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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174 52PE, H05K 506

Patent

active

041158385

ABSTRACT:
A solid state electrical component is packaged within a housing and after connection to a terminal board is potted by an encapsulating medium. The solid state electrical component includes a chip area and a plurality of terminals connected to the chip. These terminals are connected to a terminal board which provides support for additional terminal members which extend from the housing and adapted for connection in an electrical circuit. The housing and device are supported by a frame serving as a heat sink.

REFERENCES:
patent: 3201655 (1965-08-01), Bradt et al.
patent: 3439255 (1969-04-01), Carnes et al.
patent: 3638073 (1972-01-01), Bernstein
patent: 3748538 (1973-07-01), Shekerjian et al.
patent: 3801728 (1974-04-01), Gallo, Jr. et al.

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