Radiant beam exposure method

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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250398, H01J 3700

Patent

active

041818601

ABSTRACT:
A radiant beam exposure method is provided in which an IC pattern is depicted on a semiconductor pellet with the IC pattern being divided into a plurality of pattern sections. Each of the pattern sections is depicted with a number of scanning lines traversing it. Each of the scanning lines corresponds to a train of bits representing a part of the pattern section. The pattern bit train is provided at at least one end with a bit representing jointing portion. The jointing bit is used to joint divided pattern sections.

REFERENCES:
patent: 3900736 (1975-04-01), Michail et al.
patent: 4051381 (1977-09-01), Trotel
patent: 4063103 (1977-12-01), Sumi

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