Polishing fluid composition and polishing method

Details Polishing fluid composition and polishing method Polishing fluid composition and polishing method

1997-05-15

1999-03-23

Bonner, Melissa

Compositions: coating or plastic

Coating or plastic compositions

Polishes

216 88, 216 89, 438692, 438693, 252 791, 252 795, C09K 1304

Patent

active

058853340

ABSTRACT:
The present invention provides a polishing fluid composition which can effectively polish a surface of a semiconductor silicon wafer or a surface of a film comprising silicon to be formed on silicon wafers with a markedly reduced amount of colloidal silica to be used as abrasives, or a polishing fluid composition which is particularly useful for a polishing step after removal of an oxide layer in a two-step polishing method. The former polishing fluid composition comprises an alkaline suspension which contains a water-soluble silicic acid component, colloidal silica and an alkaline component, and which has a pH value of 8.5 to 13. Meanwhile, the latter polishing fluid composition comprises an alkaline solution which contains a water-soluble silicic acid component and an alkaline component, and which has a pH value of 8.5 to 13; and is substantially free of abrasive particles.

REFERENCES:
patent: 3807979 (1974-04-01), Cromwell
patent: 5397430 (1995-03-01), Philippot et al.
"Tool Engineer" 1984, pp. 38-46.
"Journal of Japan Society of Lubication Engineers," vol. 33, No. 4, 1988, pp. 253-259.

Affiliated with

Also associated with

Rating

Polishing fluid composition and polishing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing fluid composition and polishing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing fluid composition and polishing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2121273