Method for producing multilayered ceramic substrate

Details Method for producing multilayered ceramic substrate Method for producing multilayered ceramic substrate

1993-05-14

1994-12-06

Fiorilla, Christopher A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 89, 156289, 419 10, B32B 3116, B32B 1800

Patent

active

053707591

ABSTRACT:
A method for producing a multilayered ceramic substrate including the steps of:
forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material,
forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste,
laminating said green sheets to obtain a laminate,
forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet,
laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate,
firing said resultant laminate at the firing temperature, and
removing the unsintered inorganic material. The substrate does not shrink in its plane direction and surface smoothness, electrical resistance and solderability of the top layer wiring pattern are improved.

REFERENCES:
patent: 3879509 (1975-04-01), Elderbaum
patent: 4642148 (1987-02-01), Kurihara et al.
patent: 4753694 (1988-06-01), Herron et al.
patent: 4863683 (1989-09-01), Nakatani et al.
patent: 4879156 (1989-11-01), Herron et al.
patent: 5085720 (1992-02-01), Mikeska et al.
patent: 5130067 (1992-07-01), Flaitz et al.

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