Integral cooling system for electric components

Details Integral cooling system for electric components Integral cooling system for electric components

1992-03-27

1994-05-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 165142, 257714, H05K 720

Patent

active

053093194

ABSTRACT:
An integral cooling system for cooling a plurality of electronic components, including: a cooling fluid manifold for mounting over the plurality of electronic components; a main fluid inflow duct within the manifold for supplying pumped cooling fluid; a main fluid outflow duct within the manifold for removing pumped cooling fluid; for each respective electronic component of the plurality of electronic components: a component cooling chamber within the manifold, for application of cooling fluid to an area immediately adjacent the electronic component; a fluid supplying duct within the manifold to supply cooling fluid from the main fluid inflow duct to the chamber; and, a fluid removing duct within the manifold to remove cooling fluid from the chamber to the main fluid outflow duct. In preferred embodiments, there is a thermally-conductive slug or piston disposed between the respective electronic component and component cooling chamber to prevent direct application of a flow of the pumped cooling fluid to the respective electronic component, and to encourage uniform cooling across the respective electronic component.

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