Capillary tip for bonding a wire

Details Capillary tip for bonding a wire Capillary tip for bonding a wire

1988-08-10

1989-12-12

Godici, Nicholas P.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228110, 228 45, B23K 2010

Patent

active

048862002

ABSTRACT:
A wire bonding capillary tip is disclosed. A metal ball at the end of a bonding wire is positioned adjacent a material to be bonded, and pressed against the material to plastically deform the ball. The orientation of the load applied to the ball changes continuously and smoothly. Ultrasonic vibrations are applied to the metal ball to diffuse elements of the metal ball and the material mutually. The capillary tip includes a flat loading surface to press the metal ball, a through-hole opened to the loading surface for passing the wire therethrough, and a convex surface around the opening of the through-hole which connects the through-hole to the flat loading surface continuously and smoothly.

REFERENCES:
patent: 3128649 (1964-04-01), Avila et al.
patent: 3400448 (1968-09-01), Helda et al.
patent: 3643321 (1972-02-01), Field et al.
patent: 3917148 (1975-11-01), Runyon
patent: 4327860 (1982-05-01), Kirshenboin et al.
IBM Technical Disclosure Bulletin, "Ultrasonic Bonding Tip", p. 1892, vol. 10, No. 12, May 1968.
Western Electric, "Multidirectional Ultrasonic Wire Bonding Tip", p. 7, Tech. Digest No. 20, Oct. 1970.

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