Vibrational method of aligning the leads of surface-mount electr

Details Vibrational method of aligning the leads of surface-mount electr Vibrational method of aligning the leads of surface-mount electr

1989-02-21

1989-12-12

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29841, 437 9, 437203, 437204, H05K 334

Patent

active

048858412

ABSTRACT:
During solder-reflow attachment of surface-mount electronic components to a printed circuit board, vibrational energy sufficient to overcome the static coefficient of friction between the leads of a component and their respective connector pads is applied to the board, with the result that the surface tension of the molten solder between the leads and the pads will produce a best-fit alignment of the leads of each component on their corresponding connector pads.

REFERENCES:
patent: 2900701 (1959-08-01), Coggins
patent: 3092521 (1963-06-01), Pohl
patent: 3403438 (1968-10-01), Best et al.
patent: 3698075 (1972-10-01), Boyle
patent: 4376339 (1983-03-01), Ammon et al.
patent: 4386464 (1983-06-01), Yanai et al.
patent: 4528747 (1985-07-01), Hoffman et al.

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