Lead frame including deformable plates

Details Lead frame including deformable plates Lead frame including deformable plates

1982-02-10

1989-01-10

James, Andrew J.

H01L 2348, H01L 2312

Patent

active

047977264

ABSTRACT:
A lead frame for a semiconductor chip has a plurality of supporting plates connecting to each other by a plurality of readily deformable plates so that a predetermined gap exists between adjacent supporting plates. When the semiconductor chip and the supporting plates are heated when fixing the semiconductor chip to the supporting plates by melting a conductive adhesive, less stress is induced in the semiconductor chip due to uneven thermal expansion between the chip and the supporting plates since a reduced area of the chip is fixed to the supporting plates.

REFERENCES:
patent: 3708730 (1973-01-01), Schierz et al.
patent: 4048438 (1977-09-01), Zimmerman
patent: 4109269 (1978-08-01), Hatch
patent: 4258381 (1981-03-01), Inaba
patent: 4326215 (1982-04-01), Suzuki et al.

Affiliated with

Also associated with

Rating

Lead frame including deformable plates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame including deformable plates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame including deformable plates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2110907