Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-01-30
1996-03-12
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165185, 174 163, 257719, 257727, 361690, 361717, 361790, H05H 720
Patent
active
054991609
ABSTRACT:
A high density integrated circuit module which includes a plurality of stacked integrated circuit packages, wherein each package includes a casing, an integrated circuit die disposed within the casing and a plurality of electrical interconnect leads extending from the die through the casing; also including a plurality of electrically and thermally conductive vertical rails. The rails include an upper portion which extends over and is laminated to a spacer, the spacer being disposed on the upper major surface of the uppermost of the integrated circuit packages in the module, a central portion connected to the upper portion, the central portion is electrically and thermally connected to selected ones of the electrical interconnect leads, a spring-bias portion connected to the central portion, the spring-bias portion being curved to provide a spring-bias force on the rails, and a lower portion connected to the spring-bias portion, the lower portion being in surface contact with the lower major surface of the lowermost of the integrated circuit packages in the module.
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Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when the information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870, no known date.
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"Vertically-Integrated Package," Abstract, Alvin Weinberg, W. Kinzy Jones, IEEE, pp. 436-443, not known date.
"3D Interconnection For Ultra-Dense Multichip Modules," Abstract, Christian VAL, IEEE, pp. 540-547, no known date.
Staktek Corporation
Thompson Gregory D.
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