Semiconductor package with weldable ceramic lid

Details Semiconductor package with weldable ceramic lid Semiconductor package with weldable ceramic lid

1993-12-22

1996-03-12

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257660, 257704, 257710, H01L 23552

Patent

active

054989000

ABSTRACT:
An integrated circuit package for use in radiation environments includes a base and a lid of insulative materials. The base has a recess for receiving a die and a seal ring located on the periphery. The lid has a central insulation portion and an outwardly extending flange which can be welded to the seal ring.

REFERENCES:
patent: 4626960 (1986-12-01), Hamano et al.
patent: 4827082 (1989-05-01), Horiuchi et al.

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