Automatic solder paste application to circuit boards

Details Automatic solder paste application to circuit boards Automatic solder paste application to circuit boards

1988-07-11

1989-01-10

McIntosh, John

Coating apparatus

Solid applicator contacting work

With work-handling or work-supporting

118225, 118243, B05C 102

Patent

active

047965606

ABSTRACT:
Solder paste is automatically applied to circuit boards, in predetermined amounts at predetermined positions by providing a plurality of holes in a nylon, "Delrin," "Teflon" or other plastic-metal plate, the holes being in a predetermined pattern, filling solder paste into the holes which are facing in an upward direction pivoting the plate over the circuit board, and ejecting the solder paste onto a circuit board. Conveniently the solder paste is ejected by pins mounted on a further plate and reciprocated in the holes. The position of the pins in the holes during filling determines the amount of solder paste filled into the holes.

REFERENCES:
patent: 3604391 (1971-09-01), Mallia et al.
patent: 4273607 (1981-06-01), Paul

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