Method of depositing a stress-free electroless copper deposit

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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106 118, 204 38B, 427 97, 427 98, 427305, 427306, 428210, 428432, 428457, B32B 310, C23C 302

Patent

active

042282136

ABSTRACT:
A method of depositing a stress-free electroless copper deposit is disclosed. The method comprises contacting a catalyzed surface with a solution comprising a source of cupric ions; a reducing agent for the cupric ions; a complexing agent for the solution selected from (a) ethylenediaminetetraacetic acid, (b) a salt of (a), (c) a modified ethylenediamine acetic acid, (d) a salt of (c), and (e) a mixture of at least two of the foregoing complexing agents; a stabilizer for the solution comprising a mercury compound; and an accelerator for the solution comprising a water-soluble compound containing a cyanide radical (CN.sup.-) complexed with a metal selected from Group VIII of the Periodic Table of the Elements.

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