Method for rendering a non-platable semiconductor substrate plat

Details Method for rendering a non-platable semiconductor substrate plat Method for rendering a non-platable semiconductor substrate plat

1978-08-07

1980-10-14

Lawrence, Evan K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

106 111, 427304, 427305, 4274432, 427437, 427438, C23C 302, B05D 310

Patent

active

042282012

ABSTRACT:
A process is described for the reception of electrolytic or electroless plating onto a non-platable semiconductor substrate. The process comprises contacting of the semiconductor substrate with a promoter composition containing metal ions, preferably primary type, selected from the group consisting of nickel, cobalt, iron, and copper, and mixtures thereof, and a reducing agent selected from the group consisting of amine boranes, borohydrides, hydrazine, and derivatives thereof, and thereafter immersion of the substrate in conventional electrolytic or electroless plating baths, e.g., nickel or cobalt-hypophosphite type baths or copper-formaldehyde type baths, for the metallic build-up.

REFERENCES:
patent: 3096182 (1963-07-01), Berzins
patent: 3666529 (1972-05-01), Wright et al.
patent: 3772056 (1973-11-01), Polichette et al.
patent: 3853590 (1974-12-01), Kadison et al.
patent: 3870526 (1975-03-01), Pearlstein et al.
patent: 3958048 (1976-05-01), Donovan et al.
patent: 3962494 (1976-06-01), Nuzzi
patent: 3993801 (1976-11-01), Feldstein
patent: 4002778 (1977-01-01), Bellis et al.
Lowenheim, F. A., Modern Electroplating, New York, John Wiley & Sons, Inc., 1974, pp. 630, 720, 727, 728.

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