Semiconductor integrated circuit provided with emitter coupled l

Details Semiconductor integrated circuit provided with emitter coupled l Semiconductor integrated circuit provided with emitter coupled l

1991-10-25

1993-11-30

Westin, Edward P.

Electrical transmission or interconnection systems

Nonlinear reactor systems

Parametrons

3072963, 307467, H03K 1716

Patent

active

052668452

ABSTRACT:
A semiconductor integrated circuit comprises an Emitter Coupled Logic (ECL) input buffer and an ECL output buffer which are driven by m (m is equal to 2 or more) power supplies, a test ECL input buffers and a test ECL output buffers which are driven by m power supplies, and four first to fourth drive voltage supply lines for delivering drive voltages to the four input and output buffers. This semiconductor integrated circuit is characterized in that one of the m number of third drive voltage supply lines and a corresponding one of the m number of first drive voltage supply lines are commonly connected, or the third drive voltage supply lines are provided independently of the first drive voltage supply lines, and that one of m number of fourth drive voltage supply lines and a corresponding one of the m number of second drive voltage supply lines are commonly connected, or the fourth drive voltage supply lines are provided independently of the second drive voltage supply lines, whereby when the semiconductor integrated circuit is in an ordinary use state after being assembled into the system, the same voltages are delivered to the m number of third drive voltage supply lines and the m number of fourth drive voltage voltages supply lines, respectively.

REFERENCES:
patent: 4656370 (1987-04-01), Kanuma
patent: 4691123 (1987-09-01), Hashimoto
patent: 4801820 (1989-01-01), Nootbaar
patent: 4882506 (1989-11-01), Johansson et al.
patent: 4950921 (1990-08-01), Takada
patent: 5121036 (1992-06-01), Fuji
Shookhtim et al., "Novel Boundary Scan Circuit and Methodology For ECL/BiCMOS VLSI," IEEE 1990 Bipolar Circuits and Technology Meeting, 6.2, pp. 128-131 (1990).

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