Method for the manufacture of waferboard

Details Method for the manufacture of waferboard Method for the manufacture of waferboard

1993-06-08

1994-04-12

Theisen, Mary Lynn

Plastic and nonmetallic article shaping or treating: processes

Forming articles by uniting randomly associated particles

D04H 100

Patent

active

053023307

ABSTRACT:
A method for applying release agent to wood material and binder used in the manufacture of chipboard. An aqueous solution of the release agent is foamed to form a coherent foam blanket that is applied to the wood material and binder. The foam leaves a coating of release agent on the wood material and binder that enhances release of a platen from the same. Foaming the release agent avoids deleterious aerosolization and increases the efficiency of applying the release agent.

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