Method of slicing a wafer

Details Method of slicing a wafer Method of slicing a wafer

1978-12-26

1980-10-14

Whitehead, Harold D.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

83 98, 83169, 125 13R, B24B 100

Patent

active

042273480

ABSTRACT:
The quality of the as-sawn surfaces of a wafer is improved by preventing the saw blade from striking the wafer surfaces during the blade return stroke by leaning the just-sawn wafer away from the blade and by slightly retracting the face of the ingot from the plane of the saw blade. A fluid-jet-induced deformation of the binding compound portion of the ingot is preferred as a means of leaning the wafer away from the saw blade. Using this technique a number of wafers may be successively sawn from an ingot and kept attached to the ingot by the binding compound without the surfaces of the wafers being scored during the return strokes of the blade.

REFERENCES:
patent: 2874688 (1959-02-01), Biesanz
patent: 2960978 (1960-11-01), Dustan
patent: 3266967 (1966-08-01), Saunders
patent: 3577861 (1971-05-01), Bender
patent: 3702604 (1972-11-01), Jones

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