Mold for resin-packaging electronic components

Details Mold for resin-packaging electronic components Mold for resin-packaging electronic components

1993-01-21

1994-04-12

Nguyen, Khanh

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425121, 4251291, 425544, 425588, 425DIG228, 26427217, B29C 4502, B29C 4514, B29C 4532

Patent

active

053021010

ABSTRACT:
A mold for resin-packaging electronic components on a pair of leadframes includes an upper mold member and a lower mold member. The mold has two parallel rows of molding cavities, and a row of resin supplying portions arranged between the respective cavity rows. The respective molding cavities have corresponding corner portions formed with injection ports which communicate with the respective resin supplying portions through runners. The respective cavity rows together with the leadframes received in the mold are displaced relative to each other longitudinally thereof by a predetermined amount.

REFERENCES:
patent: 3184030 (1965-05-01), Ludwig
patent: 3779506 (1973-12-01), Adams
patent: 4453903 (1984-06-01), Pukaite
patent: 4511317 (1985-04-01), Bandoh
patent: 4599062 (1986-07-01), Konishi
patent: 4946633 (1990-08-01), Saeki et al.
patent: 5071334 (1991-12-01), Obara
patent: 5139728 (1992-08-01), Baird
patent: 5158780 (1992-10-01), Schraven et al.

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