Pressurizable semiconductor pellet assembly

Details Pressurizable semiconductor pellet assembly Pressurizable semiconductor pellet assembly

1977-03-21

1978-09-26

James, Andrew J.

357 72, 357 74, 357 80, 357 79, H01L 2302, H01L 2328, H01L 2342

Patent

active

041175085

ABSTRACT:
Disclosed is a semiconductor body mounted on an electrically-insulative, thermally-conductive plate which also carries metallized contacts electrically connected to the various contact areas associated with the semiconductor body. A protective one-piece insulative bridge overlies the semiconductor body and includes legs secured to the plate and a cross member extending over the body. The bridge facilitates pressing or clamping the plate in enhanced heat-transferring relation to a substrate heatsink without application of any pressure on the body or other deleterious effects to the body.

REFERENCES:
patent: 3388301 (1968-06-01), James
patent: 3414968 (1968-12-01), Genser et al.
patent: 3763403 (1973-10-01), Lootens
patent: 3783347 (1974-01-01), Vladik
patent: 3846823 (1974-11-01), Matthews et al.
patent: 3921285 (1975-11-01), Krall
patent: 4009485 (1977-02-01), Koenig

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