Metal fusion bonding – With means to cool work or product
Patent
1998-05-01
2000-09-26
Ryan, Patrick
Metal fusion bonding
With means to cool work or product
2282341, 432121, 432245, B23K 1012, B23K 3102, F27B 910
Patent
active
061232475
ABSTRACT:
An electronic unit soldering apparatus includes: a pallet on which an electronic unit to be reflow-soldered is placed; a transporting unit for transporting the pallet having the electronic unit; and a reflow furnace through which the pallet passes, the reflow furnace having: an air cooling furnace for cooling a first side of a printed-circuit board where a non-heat-resistant part is placed; and an air heating furnace for heating a second side of the printed-circuit board opposite to the first side. The pallet is placed between the cooling furnace and the electronic unit, and the pallet is a mask pallet having a hole in correspondence with a position which the non-heat-resistant part is placed.
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U.S. Patent Application No. 09/071,607, Filed May 1, 1998, Title: Electronic Unit Manufacturing Apparatus and Method, Inventor: Toshiharu Shinbo et al.
Kawaguchi Isao
Shibo Toshiharu
Matsushita Electric - Industrial Co., Ltd.
Ryan Patrick
Stoner Kiley
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