Method of constructing termination electrodes on yielded semicon

Details Method of constructing termination electrodes on yielded semicon Method of constructing termination electrodes on yielded semicon

1991-12-20

1992-12-15

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437203, 437924, 437974, H01L 21285, H01L 21283, H01L 2131

Patent

active

051717123

ABSTRACT:
A process for fabricating conductive bumps on the bond pads of yielded good die includes forming a transparent structure upon which a masking layer is formed, aligning yielded good die and attaching them to the masking layer, and attaching a backing material to the backside of the die for mechanical support. The transparent structure is then removed and fabrication of the bumps continued on the bond pads of the good die by conventional means.

REFERENCES:
Jacobs, S. L., et al., "A Multi-Chip Technology on a Stretched Polyimide Film," Polylithics, Inc., Proceedings, NEPCON West 1990, Anaheim, California, pp. 984-993, Feb. 26-31, 1990.
Johnson, T. K., "The Flexible Leaded Component (FLC): Reliable `Bare-Chip` Packaging," UniStructure, Inc., 9th Annual IEPS Conference, San Diego, California, pp. 742-753, Sep. 11-Sep. 13, 1989.

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