Thermal printhead integrated circuit device

Details Thermal printhead integrated circuit device Thermal printhead integrated circuit device

1986-05-13

1988-08-30

Goldberg, E. A.

Recorders

Thermal recording

219216, 219543, 338308, 338309, 338314, 427 96, 427402, 427 34, G01D 1510, H01C 1012, H05B 100, B05D 512

Patent

active

047680385

ABSTRACT:
An integrated circuit device having a lower layer electrode and an upper layer electrode disposed by way of an inter-layer insulation layer on an insulation substrate, wherein the pattern for disposing the lower layer electrode and the pattern for disposing the upper layer electrode are partially or entirely made substantially identical with each other. A method of manufacturing a thermal head for use in heat-sensitive recording wherein a glaze layer is disposed on an insulation substrate, a lower layer electrode of a common electrode is deposited thereover, over the lower layer electrode an insulation layer made of silicon nitride and/or silicon oxide is coated by way of plasma reaction coating and a heat generating layer and an upper layer electrode faced with a gap to individual electrodes are deposited.

REFERENCES:
patent: 3515850 (1970-06-01), Cady, Jr.
patent: 3609294 (1971-09-01), Cady et al.
patent: 4168343 (1979-09-01), Arai et al.
patent: 4259564 (1981-03-01), Ohkubo et al.
patent: 4300115 (1981-11-01), Ansell et al.
patent: 4591821 (1986-05-01), Paulson et al.

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