Thin film circuit

Details Thin film circuit Thin film circuit

1975-06-18

1977-04-26

Kendall, Ralph S.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

96 362, 174 685, 174126F, 204192F, 361274, 338308, 427 79, 427 99, 427102, 427126, 428195, 428210, 428432, 428457, 428472, B05D 512

Patent

active

040202224

ABSTRACT:
A thin film circuit consisting of a planar substrate of insulating material and a thin metal film formed from an alloy of aluminum with between 2 to 20 atom percent tantalum from which resistors and capacitors are developed. The metal film has an equivalent composition to a film which is formed by means of reactive cathode sputtering. In particular, the film is equivalent to a film formed using a cathode of aluminum and tantalum which is reactively sputtered in a sputtering atmosphere containing oxygten with a low partial pressure.In such an arrangement, the temperature coefficient of resistance and the capacity temperature coefficient compensate one another. The alloy films have a high oxidation stability and the resistors and capacitors therefrom have a high resistance to aging.

REFERENCES:
patent: 3489656 (1970-01-01), Balde
patent: 3627577 (1971-12-01), Steidel
patent: 3737343 (1973-06-01), Basseches et al.
patent: 3738919 (1973-06-01), Chilton et al.

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