Method and apparatus for forming a deposit by means of ion plati

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204298, C23C 1500

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active

041167910

ABSTRACT:
A substrate to be coated by the ion-plating technique is placed on or in the immediate vicinity of a first cathode confronting a second cathode in an enclosure containing a rarefied gaseous atmosphere, the second cathode constituting a target of material to be deposited on the substrate. The application of a relatively high negative biasing voltage to the first cathode, relative to the grounded enclosure, generates a glow discharge resulting in ionic cleaning of the substrate. A sputtering discharge generated by a relatively low negative biasing voltage on the second cathode is intensified by a toroidal magnet on its far side (remote from the first cathode) whose lines of force penetrate the target and close in the intercathode space to form an endless track for circulating electrons. During the cleaning phase, the substrate is protected against premature particle deposition by the temporary interposition of a shield between itself and the target or by being located at a distance from the active portion of the second cathode; energization of the latter thereafter builds up a coating of target material on the cleaned substrate.

REFERENCES:
patent: 3514388 (1970-05-01), Brumfield et al.
patent: 3732158 (1973-05-01), Przybyszewski et al.
patent: 3878085 (1975-04-01), Corbani
N. Ohmae et al., "Prevention of Fretting by Ion Plated Film", Wear, vol. 30, pp. 299-309 (1974).
S. Schiller et al., "Alternating Ion Plating-A Method of High Rate Ion Vapor Deposition", J. Vac. Sci. Tech., vol. 12, pp. 858-864 (1975).

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