Method of packaging chip on substrate

Details Method of packaging chip on substrate Method of packaging chip on substrate

1992-05-27

1993-11-30

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29740, 29759, 29832, H05K 330

Patent

active

052653307

ABSTRACT:
A method of packaging each of chips on a substrate within each of different cycle time periods through a packaging device driven by a motor, the packaging device being arranged to pick up the chip and carrying it to the substrate for the packaging, the method comprises the step of gradually decreasing a rotational speed of the motor when the cycle time period is changed to be longer and gradually increasing the rotational speed of the motor when the cycle time period is changed to be shorter. This method can package chips at a high speed on the substrate without increasing the capacity of the motor.

REFERENCES:
patent: 4807356 (1989-02-01), Maruyama et al.
patent: 5060366 (1991-10-01), Asai et al.
patent: 5086559 (1992-02-01), Akatsuchi
patent: 5136776 (1992-08-01), Yanagisawa

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