Clip for paralleling packaged integrated circuit chips

Geometrical instruments

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

339 17M, 339255P, H05K 112

Patent

active

041165187

ABSTRACT:
A clip having two body elements, each containing a plurality of parallel electrical contacts for simultaneously engaging like contact pins of stacked integrated circuit chips in order to electrically connect the contact pins in parallel. At least one of the electrical contacts being deletable from the body element in order to maintain at least one of the contact pins of each of the integrated circuit chips electrically isolated from the others.

REFERENCES:
patent: 3045336 (1962-07-01), Northrop et al.
patent: 3506949 (1970-04-01), Venaleck et al.
patent: 3912984 (1975-10-01), Lockhart, Jr. et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Clip for paralleling packaged integrated circuit chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clip for paralleling packaged integrated circuit chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clip for paralleling packaged integrated circuit chips will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2085451

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.