Electrical sub-assembly having a lead frame to be compressed bet

Details Electrical sub-assembly having a lead frame to be compressed bet Electrical sub-assembly having a lead frame to be compressed bet

1984-01-17

1985-02-05

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361412, 174 16HS, H05K 720

Patent

active

044981201

ABSTRACT:
An electrical sub-assembly (11) includes an electrically insulating heat conducting substrate (12) and an inter-connected series of spaced lead frame elements (15) which are sandwiched between a printed circuit board (37) and a heat sink (35). A clamp (43) is operatively connected to the printed circuit board (37) and the heat sink (35) to apply clamping pressure through the series of lead frame elements (15) to provide intimate engagement between the substrate (12) and the heat sink (35) to enhance the heat transfer from one or more circuits (i.e. 16, 25, 26, 27) through the substrate (12) to the heat sink (35).

REFERENCES:
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patent: 3501598 (1970-03-01), Lis
patent: 3801728 (1974-04-01), Gallo, Jr.
patent: 3836704 (1974-09-01), Coules
patent: 3911327 (1975-10-01), Murari
patent: 4069497 (1978-01-01), Steidlitz
patent: 4204248 (1980-05-01), Proffit
patent: 4218724 (1980-08-01), Kaufman
patent: 4250481 (1981-02-01), Kaufman
patent: 4257091 (1981-03-01), Kaufman
patent: 4266140 (1981-05-01), Kaufman
patent: 4349861 (1982-09-01), Zizza
Power Hybrid Module, IBM Tech. Discl. Bull., Liu, vol. 16, No. 11, Apr. 1974, p. 3827.
External Module Heat Sink, IBM Tech. Discl. Bull., Cunavelis, vol. 14, No. 1, Jun. 1971, p. 182.

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