Method for dip-soldering semiconductor components

Details Method for dip-soldering semiconductor components Method for dip-soldering semiconductor components

1976-03-11

1977-04-26

Smith, Al Lawrence

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228180R, 228218, 228259, H01L 2160

Patent

active

040196712

ABSTRACT:
A method and apparatus for dip-soldering semiconductor components is disclosed as including a temperature-controlled solder bath and a gas supply line disposed along one edge of the upper surface of the bath. Hydrogen and nitrogen gases are selectively supplied and discharged from nozzles of the supply line by means of a two-way control valve, and the supply line is vertically, horizontally, and rotatably adjustable with respect to the bath container and the bath surface so as to precisely locate the position of the gas nozzles with respect thereto.

Affiliated with

Also associated with

Rating

Method for dip-soldering semiconductor components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for dip-soldering semiconductor components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for dip-soldering semiconductor components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2084166