Concave face wire bond capillary

Details Concave face wire bond capillary Concave face wire bond capillary

1998-09-29

2000-12-12

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 45, 228904, B23K 3700, B23K 3100

Patent

active

061586471

ABSTRACT:
An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

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