Flat connection for a semiconductor multilayer structure

Details Flat connection for a semiconductor multilayer structure Flat connection for a semiconductor multilayer structure

1975-03-21

1976-09-28

Dier, Philip

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 427 90, 427 96, 156 17, 29576R, 148 333, B32B 300, C23B 108, H01L 2710

Patent

active

039832848

ABSTRACT:
Upon a substrate containing different zones which are to be connected with one another, there are successively deposited a layer of thickness e.sub.1, of a first metal (tantalum) oxidizable by heat treatment, and a layer of thickness e.sub.2 of a second metal (aluminium) non-oxidizable by said treatment, deposited upon the surface of the first layer in accordance with the desired connection profile. The thickness of the aluminium layer is controlled so that it is equal to the increase in thickness of the tantalum layer as a consequence of the transformation of the tantalum into tantalum oxide.

REFERENCES:
patent: 3106489 (1963-10-01), Lepselter
patent: 3231421 (1966-01-01), Schmidt
patent: 3575745 (1971-04-01), Hill
patent: 3668004 (1972-06-01), Yamamoto et al.
patent: 3699011 (1972-10-01), Nishimura
patent: 3737341 (1973-06-01), Croset et al.
patent: 3801477 (1974-04-01), Ronen et al.
patent: 3844831 (1974-10-01), Cass et al.
patent: 3862017 (1975-01-01), Tsunemitsu et al.

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