Semiconductor pressure sensor and method of manufacturing the sa

Details Semiconductor pressure sensor and method of manufacturing the sa Semiconductor pressure sensor and method of manufacturing the sa

1986-09-24

1988-08-30

Woodiel, Donald O.

Metal working

Method of mechanical manufacture

Electrical device making

29454, 73721, 73727, 73DIG4, 338 4, G01L 708, G01L 906, H01C 1700

Patent

active

047666668

ABSTRACT:
A semiconductor pressure sensor composed of a substrate formed adopting a thin-film forming technique and a diaphragm which is formed on the surface of the substrate. The sensor includes an insulating diaphragm film which is formed of an etching-resistant material on the main surface of the semiconductor substrate such as to coat it, at least one etching hole provided such as to penetrate the diaphragm film and reach the substrate, a reference pressure chamber which is formed by etching to remove a part of the semiconductor substrate and a disappearing film through the etching hole, and at least one strain gage which is provided at a predetermined position in the pressure receiving region of the diaphragm film. All the processing steps of the sensor are conducted solely on the main surface of the semiconductor substrate, namely, on a single side. Therefore, it is possible to manufacture the sensor itself utilizing the substantially same technique as the known integrated circuit manufacturing technique and to form the diaphragm with a predetermined thickness such that it may process a thin and precisely dimensioned thickness.

REFERENCES:
patent: 3858150 (1974-12-01), Gurtler et al.
patent: 4003127 (1977-01-01), Jaffe et al.
patent: 4188258 (1980-02-01), Mounteer et al.
patent: 4432007 (1984-02-01), Cady
patent: 4618397 (1986-10-01), Shimizu et al.
patent: 4670092 (1987-06-01), Motamedi

Affiliated with

Also associated with

Rating

Semiconductor pressure sensor and method of manufacturing the sa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor pressure sensor and method of manufacturing the sa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor pressure sensor and method of manufacturing the sa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2080473