Thick film conductors for use in microelectronic packaging

Details Thick film conductors for use in microelectronic packaging Thick film conductors for use in microelectronic packaging

1979-11-16

1982-09-21

Wojciechowicz, E.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 357 67, 357 68, 106 113, 106 115, 106 121, H01B 102, H01L 2348, C09D 510

Patent

active

043506186

ABSTRACT:
In a microelectronic package of the type where Si-based integrated circuits are eutectically attached to a Pd/Au-based thick film conductor, a method of reducing the potential for thermal runaway is taught. The method involves increasing the surface area of the Pd to lower the Vbe rating. This reduces the potential for thermal runaway in subsequent integrated circuit operation. It has also been found that increasing the particle size of the Au component further decreases the Vbe rating.

REFERENCES:
patent: 4187201 (1980-02-01), Hilson et al.

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