Bonding ridge structure laser diodes to substrates

Details Bonding ridge structure laser diodes to substrates Bonding ridge structure laser diodes to substrates

1998-05-05

2000-06-13

Font, Frank G.

Coherent light generators

Particular temperature control

Heat sink

372 34, 372 50, 438 25, 438 26, 438108, 438118, 257777, 257778, H01S 304, H01S 319, H01L 2348

Patent

active

060758007

ABSTRACT:
A way of bonding a ridge-structure laser diode chip ridge face down on to a substrate with solder is disclosed in which the substrate surface includes a region facing the ridge of the laser that is not wetted by solder, this region being flanked by regions that are wetted and by which the solder bonds the chip to the substrate in a manner that leaves the ridge freely spaced from the substrate surface.

REFERENCES:
Nakada et al, 1974, applied physics, vol. 13 No. 9, pp. 1435-1436.

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