Thick-film conductor compostions comprising silver or palladium

Details Thick-film conductor compostions comprising silver or palladium Thick-film conductor compostions comprising silver or palladium

1996-06-24

1998-02-10

Lieberman, Paul

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 252520, 419 35, 419 64, 427216, 428403, H01B 116, H01B 122, B05D 700

Patent

active

057165521

ABSTRACT:
A thick-film conductor paste and thick-film conductors formed therefrom. The conductor paste is composed of metallic particles coated with a ceramic layer that reduces leaching and solder diffusion into the conductor, thereby improving the reliability of the conductor-solder bond. The ceramic layer may be continuous or discontinuous, and may be applied to some or all of the particles of the conductor paste.

REFERENCES:
patent: 4493789 (1985-01-01), Ueyama et al.
patent: 4521329 (1985-06-01), Siuta et al.
patent: 5207950 (1993-05-01), Ehrreich
patent: 5294374 (1994-03-01), Martinez et al.
patent: 5453293 (1995-09-01), Beane et al.

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