Inspection device for inspecting a semiconductor wafer

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324758, G01R 3102, G01R 104

Patent

active

060753730

ABSTRACT:
The invention provides a simple, light-weight inspection device by arranging a mechanical path switching mechanism. The invention includes a device main body, one or more inspection targets having a plurality of connection pads, a test portion for measuring the electrical characteristics of the inspection targets on the basis of electrical signals from the inspection targets, a mounting device for mounting the inspection targets at predetermined positions with respect to the device main body, a probe card having a plurality of probe pads on its upper surface, which are electrically connected to the connection pads of the inspection targets mounted on the mounting device through an electrical contact device, a contact block having contact pins which removably contact the respective probe pads of the probe card, a connection device for electrically connecting the contact pins of the contact block and the test portion, and a contact block support/moving device for movably supporting the contact block in the circumferential direction at the peripheral of the probe card. In the invention, the plurality of probe pads are divided into a plurality of groups, which are circumferentially arranged at peripheral portions of the upper surface of the probe card.

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