Printed circuit assembly having locally enhanced wiring density

Details Printed circuit assembly having locally enhanced wiring density Printed circuit assembly having locally enhanced wiring density

1998-11-19

2000-11-14

Gandhi, Jayprakash N.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361760, 361735, 174255, 174257, 174265, 22818021, 428166, H05K 111

Patent

active

061478709

ABSTRACT:
A printed circuit assembly and method of making the same facilitates the attachment of high density modules onto a printed circuit board. In one embodiment, the high density modules are attached to the printed circuit board using an adhesive having a conductive material disposed within at least one via. In an alternate embodiment, an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive adhesive is used to attach the module to the printed circuit board. When the adhesive layer is disposed between a module and a printed circuit, individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on a module that opposes a printed circuit board and is thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations. The conductive posts may also comprise a conductive ink.

REFERENCES:
patent: Re35064 (1995-10-01), Hernandez
patent: 2692190 (1954-10-01), Pritikin
patent: 2721822 (1955-10-01), Pritikin
patent: 3181986 (1965-05-01), Pritikin
patent: 3350498 (1967-10-01), Leeds
patent: 3475213 (1969-10-01), Stow
patent: 3680037 (1972-07-01), Nellis
patent: 3823252 (1974-07-01), Schmid
patent: 3835531 (1974-09-01), Luttmer
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 3986255 (1976-10-01), Mandal
patent: 4064623 (1977-12-01), Moore
patent: 4157932 (1979-06-01), Hirata
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4545840 (1985-10-01), Newman et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 4771159 (1988-09-01), O'Leary
patent: 4778635 (1988-10-01), Hechtman et al.
patent: 4814040 (1989-03-01), Ozawa
patent: 4908258 (1990-03-01), Hernandez
patent: 4991285 (1991-02-01), Shaheen et al.
patent: 5001302 (1991-03-01), Atsumi
patent: 5038251 (1991-08-01), Suiyama et al.
patent: 5041183 (1991-08-01), Nakamura et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5093986 (1992-03-01), Mandai et al.
patent: 5112464 (1992-05-01), Tsou et al.
patent: 5137791 (1992-08-01), Swisher
patent: 5147084 (1992-09-01), Behun et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5225966 (1993-07-01), Basavanhally et al.
patent: 5235741 (1993-08-01), Mase
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5318651 (1994-06-01), Matsui et al.
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5329695 (1994-07-01), Traskos et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5346775 (1994-09-01), Jin et al.
patent: 5364707 (1994-11-01), Swisher
patent: 5376403 (1994-12-01), Capote et al.
patent: 5401909 (1995-03-01), Arnold et al.
patent: 5401913 (1995-03-01), Gerber et al.
patent: 5409157 (1995-04-01), Nagesh et al.
patent: 5429293 (1995-07-01), Bradley, III et al.
patent: 5431571 (1995-07-01), Hanrahan et al.
patent: 5435732 (1995-07-01), Angulas et al.
patent: 5439162 (1995-08-01), George et al.
patent: 5445308 (1995-08-01), Nelson et al.
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5457881 (1995-10-01), Schmidt
patent: 5468655 (1995-11-01), Greer
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5497938 (1996-03-01), McMahon et al.
patent: 5538789 (1996-07-01), Capote et al.
patent: 5545281 (1996-08-01), Matsui et al.
patent: 5582745 (1996-12-01), Hans et al.
patent: 5600103 (1997-02-01), Odaira et al.
patent: 5634265 (1997-06-01), Difrancesco
patent: 5736681 (1998-04-01), Yamamoto et al.
patent: 5912438 (1999-06-01), Kubin

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