Semiconductor package having interlocking heat sinks and method

Details Semiconductor package having interlocking heat sinks and method Semiconductor package having interlocking heat sinks and method

1998-06-08

2000-06-13

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257712, 257796, 257723, 257693, 257692, 257686, 257685, 257797, 257707, 257713, 257730, 361704, H01L 2302, H01L 2334, H01L 2328, H05K 702, H05K 720

Patent

active

060752882

ABSTRACT:
A semiconductor package includes a semiconductor die, a lead frame wire bonded to the die, and a plastic body encapsulating the die. The package also includes a first heat sink attached to a face of the die, and a second heat sink attached to a back side of the die. Thermally conductive adhesive layers attach the heat sinks to the die, and provide a thermal path therebetween. In addition, the heat sinks project from the plastic body, and have end portions that are sized and shaped to interlock with heat sinks on an adjacent package to form an electronic assembly. In the electronic assembly, the interlocking heat sinks maintain contact surfaces on the heat sinks in physical contact and improve heat dissipation from the packages. An alternate embodiment package includes a thermally conductive encapsulant which attaches a pair of heat sinks, and encapsulates the die.

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