Stress clip design

Details Stress clip design Stress clip design

1998-01-30

2000-06-13

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257669, 257666, 257695, 257696, H01L 23495, H01L 2348, H01L 2352

Patent

active

060752866

ABSTRACT:
A semiconductor package includes a base plate, a semiconductor die having top and bottom surfaces, the bottom surface being mounted to the base plate, and a conductor tab having first and second ends, the first end being adapted to communicate with and couple to external circuitry, the second end including a relatively wide foot having a plurality of finger portions separated by gaps, the finger portions being mounted to an covering a substantial portion of the top surface of the semiconductor die.

REFERENCES:
patent: 2869053 (1959-01-01), Schaper
patent: 3519890 (1970-07-01), Ashby
patent: 3821615 (1974-06-01), Nordstrom et al.
patent: 3988171 (1976-10-01), Miller et al.
patent: 4125740 (1978-11-01), Paletto
patent: 4194174 (1980-03-01), DeLise
patent: 4963975 (1990-10-01), Sawaya
patent: 4984063 (1991-01-01), Terashima
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5053852 (1991-10-01), Biswas et al.
patent: 5231303 (1993-07-01), Kasahara et al.
patent: 5250839 (1993-10-01), Katoh et al.
patent: 5365106 (1994-11-01), Watanabe
patent: 5581118 (1996-12-01), Mays
patent: 5886400 (1999-03-01), Letterman, Jr. et al.

Affiliated with

Also associated with

Rating

Stress clip design does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stress clip design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stress clip design will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2070694