High-thermal-conductivity sealed package for fiber optic couplin

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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G02B 636

Patent

active

058728813

ABSTRACT:
A hermetically sealed package for an optoelectronic device such as a diode laser comprises a side wall welded to a thermally conductive heat sink mount, and a lid welded to the side wall. Testing and alignment of the device are performed before the attachment of the side wall to the mount. Feedthroughs for optical fibers and electrical connections run through the side wall. The feedthrough seals are established within projections extending away from the side wall, to protect the seals from melting during welding steps. A high-resistivity piece is present at the interface between the side walls and the base, to provide heating localized to the interface, and thereby reduce the heating of the laser during welding. The mount is pressed into a receiving structure, which is attached to an external heat sink. The bottom surface of the mount protrudes from the receiving structure, and is in direct contact with the external heat sink. In an alternative embodiment, the optoelectronic device and optical fiber are encapsulated in epoxy after optical and electrical testing and alignment.

REFERENCES:
patent: 4119363 (1978-10-01), Camlibel et al.
patent: 4752109 (1988-06-01), Gordon et al.
patent: 4977243 (1991-03-01), Aiki et al.
patent: 5029968 (1991-07-01), Geiser, Jr. et al.
patent: 5430820 (1995-07-01), van Tongeren et al.
patent: 5717804 (1998-02-01), Pan et al.

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