Ultrahigh-frequency electronic component and method of manufactu

Details Ultrahigh-frequency electronic component and method of manufactu Ultrahigh-frequency electronic component and method of manufactu

1998-01-08

1999-10-19

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, 438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

059703229

ABSTRACT:
An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

REFERENCES:
patent: 4890155 (1989-12-01), Miyagawa et al.
patent: 4894704 (1990-01-01), Endo
patent: 5304512 (1994-04-01), Arai et al.

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