Low impedance contoured laminated bus assembly and method for ma

Electric power conversion systems – Current conversion – With conductive support mounting

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361611, 174 72B, H02M 110, H01B 500

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active

058727116

ABSTRACT:
A curved low impedance laminated bus assembly includes a curved first sheet of relatively thin conductive material forming an AC bus conductor and a curved second sheet of relatively thin conductive material forming a -DC bus conductor directly connected to a -DC line side of a DC energy storage device. A curved third sheet of relatively thin conductive material forms a +DC bus conductor directly connected to a +DC line side of the DC energy storage device and is connected to the AC bus conductor through a +DC switch. A plurality of dielectric sheets are laminated between the AC bus conductor, the -DC bus conductor, and the +DC bus conductor. A method of making the low impedance laminated bus assembly includes providing a first substantially planar sheet of relatively thin conductive material forming an AC bus conductor, providing a second substantially planar sheet of relatively thin conductive material forming a -DC bus conductor, providing a third substantially planar sheet of relatively thin conductive material forming a +DC bus conductor, providing plurality of dielectric sheets, stacking said plurality of dielectric sheets between said AC bus conductor, said -DC bus conductor, and said +DC bus conductor to form a laminated bus structure having alternating conductive and non-conductive layers. Lastly, the laminated bus structure is bent from a first substantially planar shape to a second curved shape.

REFERENCES:
patent: 3895285 (1975-07-01), Bardahl et al.
patent: 4224663 (1980-09-01), Maiese et al.
patent: 4346257 (1982-08-01), Moss et al.
patent: 4599486 (1986-07-01), Herrandez
patent: 5172310 (1992-12-01), Deam et al.
patent: 5313363 (1994-05-01), Arbanas
patent: 5365424 (1994-11-01), Deam et al.
patent: 5388028 (1995-02-01), Arbanas
patent: 5517063 (1996-05-01), Schantz, Jr. et al.
patent: 5521811 (1996-05-01), Levran et al.
patent: 5579217 (1996-11-01), Deam et al.
patent: 5623399 (1997-04-01), Ishii et al.
A Low Inducance, Simplifed Snubber, Power Inverter Implementation, Christopher A. Dimino, Ravi dodballapur, James A. Pomes, Magna Tek Drives and Systems Division, Apr. 1994, pp. 502-508.

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