Multi layer circuit board using anisotropic electroconductive ad

Details Multi layer circuit board using anisotropic electroconductive ad Multi layer circuit board using anisotropic electroconductive ad

1997-08-12

2000-11-14

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174259, 361779, 439 91, H05K 346

Patent

active

061473111

ABSTRACT:
An anisotropic electro-conductive adhesive layer 14 including an adhesive 15 made of a thermosetting or thermoplastic resin containing electro-conductive particles 16 dispersed therein is formed on a basic circuit board 11 carrying a first circuit pattern 12. A second circuit pattern 18 is formed on the anisotropic electro-conductive adhesive layer 14. An end of the second circuit pattern 18 is curved into the anisotropic electro-conductive adhesive layer 14 to be electrically connected with first circuit pattern 12 via the electro-conductive particles 16. Thereby, the production process can be simplified and the production cost can be reduced. Also, the micro-circuit patterns can be arranged at a high density.

REFERENCES:
patent: 5461775 (1995-10-01), Tanabe et al.
patent: 5677576 (1997-10-01), Akagawa
patent: 5744758 (1998-04-01), Takenouchi et al.

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